JPH0446381Y2 - - Google Patents
Info
- Publication number
- JPH0446381Y2 JPH0446381Y2 JP1987190608U JP19060887U JPH0446381Y2 JP H0446381 Y2 JPH0446381 Y2 JP H0446381Y2 JP 1987190608 U JP1987190608 U JP 1987190608U JP 19060887 U JP19060887 U JP 19060887U JP H0446381 Y2 JPH0446381 Y2 JP H0446381Y2
- Authority
- JP
- Japan
- Prior art keywords
- board
- printed circuit
- circuit board
- hybrid
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Multi-Conductor Connections (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987190608U JPH0446381Y2 (en]) | 1987-12-15 | 1987-12-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987190608U JPH0446381Y2 (en]) | 1987-12-15 | 1987-12-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0195071U JPH0195071U (en]) | 1989-06-22 |
JPH0446381Y2 true JPH0446381Y2 (en]) | 1992-10-30 |
Family
ID=31481563
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987190608U Expired JPH0446381Y2 (en]) | 1987-12-15 | 1987-12-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0446381Y2 (en]) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5450855B2 (ja) * | 2013-02-25 | 2014-03-26 | 日本特殊陶業株式会社 | 配線基板、ic電気特性検査用配線基板、及び配線基板の製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0236216Y2 (en]) * | 1985-02-22 | 1990-10-02 | ||
JPS62167374U (en]) * | 1986-04-11 | 1987-10-23 |
-
1987
- 1987-12-15 JP JP1987190608U patent/JPH0446381Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPH0195071U (en]) | 1989-06-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5406458A (en) | Printed circuit board having tapered contact pads for surface mounted electrical components | |
JPH0365005B2 (en]) | ||
JPH0446381Y2 (en]) | ||
JP3894336B2 (ja) | 電子部品 | |
JP2512529Y2 (ja) | ハイブリッドic基板に対するリ―ド端子の接続構造 | |
JPH06349561A (ja) | リード端子の配線基板への半田付け方法 | |
JPH033972Y2 (en]) | ||
JPH067275U (ja) | プリント基板 | |
JPS61115343A (ja) | 半導体集積回路 | |
JPH11145608A (ja) | プリント基板およびその製造方法 | |
JPS61191095A (ja) | 回路装置およびその製造方法 | |
JPH04122055A (ja) | 電子部品の予備半田付け治具および保持具 | |
JPH07263848A (ja) | プリント配線板 | |
JPS58197897A (ja) | はんだ接合方法 | |
JPH0353516Y2 (en]) | ||
JP2553989Y2 (ja) | 電子部品 | |
JPS5916397A (ja) | 電子機器用回路装置 | |
JP2001298264A (ja) | はんだチップ | |
JPH04284379A (ja) | 電子部品搭載用基板の製造方法 | |
JPH03233995A (ja) | チップ部品の実装方法 | |
JPH0410190B2 (en]) | ||
JPH05121867A (ja) | プリント配線板へのフラツトパツケージのセツト方法 | |
JPS5845199B2 (ja) | リ−ド線接続方法 | |
JPH0569974U (ja) | プリント配線板 | |
JPH0562067U (ja) | 回路基板 |